How is Future Institute of Engineering and Management for B.Tech ECE in terms of placements?

<p>Future Institute of Engineering and Management (FIEM) offers good placement opportunities for B.Tech in Electronics and Communication Engineering (ECE) students. The highest salary package offered is 13.4 LPA, with an average package of 4 LPA . Companies like TCS, Wipro, Cognizant, Infosys, and IBM are among the top recruiters, providing placements to almost all students, especially from CSE, IT, and ECE departments . The placement rate is high, with around 80% or more students getting placed, and students become eligible for placements from the end of the 6th semester. The institute also offers internship opportunities with companies like Cognizant, Mindtree, and TCS, providing valuable training in various skills like JAVA, DotNet, HTML, CSS, and Python .Overall, FIEM is a favorable choice for B.Tech ECE students seeking good placement prospects.</p>

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